4-Port PoE Manager

Microsemi Proprietary and Confidential. PD69104B1/F Datasheet Revision 2.0

22

6

Package Information

The following sections describe the package information for the PD69104B1/F device.

6.1

Package Outline Drawing

The following illustration shows the package outline drawing for the PD69104B1/F device.

Figure 12 • Package Outline Drawing

The following table lists the dimensions and measurements of the PD69104B1/F device.

Table 18 • Dimensions and Measurements

Dim

Millimeters

Inches

Min

Max

Min

Max

A

0.80

1.00

0.031

0.039

A1

0.00

0.05

0

0.002

A3

0.20 ref

0.008 ref

K

0.20 min

0.008 min

e

0.50 BSC

0.02 BSC

L

0.30

0.50

0.012

0.02

b

0.18

0.30

0.007

0.012

D2

6.35

6.60

0.250

0.260

E2

6.35

6.60

0.250

0.260

D

8.00 BSC

0.315 BSC

E

8.00 BSC

0.315 BSC

Note: Dimensions do not include protrusions; these shall not exceed 0.155 mm (.006") on any side. The

lead dimension shall not include solder coverage.

6.2

Thermal Specifications

Thermal resistance-junction to ambient is 25 °C/W.

Thermal resistance-junction to case is 4 °C/W.