5.5 Electrical Characteristics, Power Supply Currents

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MIN

TYP

MAX

UNIT

ICC(ACTIVE

)

Average active current; link in U0 with SuperSpeed data transmission; OS = 0.9V; DE

= 0dB

100

130

mA

ICC(U2/U3)

Average current in U2/U3

1.3

mA

ICC(NC)

Average current with no connection

No SuperSpeed device is connected to TXP/TXN

0.3

mA

5.6 Electrical Characteristics, DC

over operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

TRI-STATE CMOS INPUTS (CNFG_A1, CNFG_B1, CNFG_A2 and CNFG_B2)

VIH

High-level input voltage

VCC x 0.75

V

VIM

Mid-level input voltage

VCC / 2

V

VIL

Mid-level input voltage

VCC x 0.25

V

VF

Floating voltage

VIN = High impedance

VCC / 2

V

R(PU)

Internal pull-up resistance

105

kΩ

R(PD)

Internal pull-down resistance

105

kΩ

IIH

High-level input current

VIN = 1.98V

26

µA

IIL

Low-level input current

VIN = GND

–26

µA

Ilkg

External leakage current (from

application board + Application

Processor pin high impedance)

tolerance

VIN = GND or VIN = 1.98V

–1

1

µA

CMOS INPUT – SEL

VIH

High-level input voltage

VCC x 0.7

V

VIL

Mid-level input voltage

VCC x 0.3

V

IIH

High-level input current

VIN = 1.98V

5

µA

IIL

Low-level input current

VIN = GND

–16

µA

www.ti.com

TUSB542

SLLSER3F – DECEMBER 2015 – REVISED DECEMBER 2023

Copyright © 2023 Texas Instruments Incorporated

Submit Document Feedback

5

Product Folder Links: TUSB542