ANT-2.4-CW-RCL-RPS datasheet(27/73 Pages) MICROCHIP

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WINCS02IC and WINCS02 Family

Device Overview

Data Sheet

DS70005577B - 27

Table 2-5. Approved External Antenna List with Antenna Gain for WINCS02 Module (continued)

Antenna

No.

Part Number

Manufacturer

Antenna

Gain (dBi)

Antenna

Type

Regulatory

Certification

FCC/ISED(2)

(3)

RFA-02-C2H1-D034

Alead

Dipole

RFA-02-D3

Aristotle

Dipole

RFDPA870920IMLB301

Walsin

1.84

Dipole

RFDPA870920IMAB302(5)

Walsin

1.82

Dipole

RFDPA870920IMAB305

Walsin

1.82

Dipole

RFDPA870910IMAB308(5)

Walsin

Dipole

RFA-02-C2M2

Aristotle

Dipole

RN-SMA-S-RP(5)

Microchip

0.56

Dipole

W1049B030(5)

Pulse

Dipole

RN-SMA4-RP

Microchip

2.2

Dipole

Notes:

1. ‘x’ denotes the antennas covered under the certification.

2. If the end product using the module is designed to have an antenna port that is accessible to the end user, a unique

(non-standard) antenna connector (as permissible by FCC) must be used (for example, RP (Reverse Polarity)-SMA

socket).

3. If an RF coaxial cable is used between the module RF output and the enclosure, a unique (non-standard) antenna

connector must be used in the enclosure wall to interface with the antenna.

4. Contact the antenna vendor for detailed antenna specifications to review the suitability to the end product operating

environment and to identify alternatives.

5. If any of these antennas are used, an additional post-calibration step is required on the customer's application board.

For more details, refer to the WINCS02 Module External Antenna Calibration Guide (DS50003753).

2.8

WINCS02 Module Reflow Profile Information

The WINCS02 Module was assembled using the IPC/JEDEC J-STD-020 standard lead-free reflow

profile. The WINCS02 Module can be soldered to the host board using standard leaded or lead-free

solder reflow profiles. To avoid damaging the module, adhere to the following recommendations:

• For solder reflow recommendations, refer to the AN233 Solder Reflow Recommendation Application

Note (DS00233).

• Do not exceed a peak temperature (TP) of 250°C.

• For specific reflow profile recommendations from the vendor, refer to the Solder Paste Data Sheet.

• Use no-clean flux solder paste.

• Do not wash as moisture can be trapped under the shield.

• Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.

2.8.1

Cleaning

The exposed GND pad helps to self-align the module, avoiding pad misalignment. The

recommendation is to use the no clean solder pastes. Ensure full drying of no-clean paste fluxes as

a result of the reflow process. As per the recommendation by the solder paste vendor, this requires

longer reflow profiles and/or peak temperatures toward the high end of the process window. The

uncured flux residues can lead to corrosion and/or shorting in accelerated testing and possibly the

field.

2.9

WINCS02 Module Assembly Considerations

The WINCS02 Module is assembled with an Electro-Magnetic Interference (EMI) shield to ensure

compliance with EMI emission and immunity rules. The EMI shield is made of a tin-plated steel

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