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MPC8245 데이터시트(PDF) 31 Page - Freescale Semiconductor, Inc

부품명 MPC8245
상세설명  Integrated Processor Hardware Specifications
PDF  68 Pages
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제조업체  FREESCALE [Freescale Semiconductor, Inc]
홈페이지  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

MPC8245 데이터시트(HTML) 31 Page - Freescale Semiconductor, Inc

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MPC8245 Integrated Processor Hardware Specifications, Rev. 10
Freescale Semiconductor
31
Package Description
Figure 23. Test Access Port Timing Diagram
5
Package Description
This section details package parameters, pin assignments, and dimensions.
5.1
Package Parameters
The MPC8245 uses a 35 mm
× 35 mm, cavity-up, 352-pin tape ball grid array (TBGA) package. The
package parameters are as follows.
Package Outline
35 mm
× 35 mm
Interconnects
352
Pitch
1.27 mm
Solder Balls
ZU (TBGA package)—62 Sn/36 Pb/2 Ag
VV (Lead-free version of package)—95.5 Sn/4.0 Ag/0.5 Cu
Solder Ball Diameter
0.75 mm
Maximum Module Height
1.65 mm
Co-Planarity Specification
0.15 mm
Maximum Force
6.0 lbs. total, uniformly distributed over package (8 grams/ball)
10
11
Input Data Valid
12
13
Output Data Valid
TCK
TDI, TMS
TDO
TDO



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