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MPC8309CVMADDC 데이터시트(PDF) 14 Page - NXP Semiconductors |
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MPC8309CVMADDC 데이터시트(HTML) 14 Page - NXP Semiconductors |
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14 / 81 page ![]() MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3 14 Freescale Semiconductor DDR2 SDRAM The following table provides the PLL lock times. 5.1 Reset Signals DC Electrical Characteristics The following table provides the DC electrical characteristics for the MPC8309 reset signals mentioned in Table 9. 6DDR2 SDRAM This section describes the DC and AC electrical specifications for the DDR2 SDRAM interface of the MPC8309. Note that DDR2 SDRAM is GVDD(typ) = 1.8 V. 6.1 DDR2 SDRAM DC Electrical Characteristics The following table provides the recommended operating conditions for the DDR2 SDRAM component(s) of the MPC8309 when GVDD(typ) = 1.8 V. The following table provides the DDR2 capacitance when GVDD(typ) = 1.8 V. Input setup time for POR configuration signals (CFG_RESET_SOURCE[0:3]) with respect to negation of PORESET 4— tSYS_CLK_IN 1, 2 Input hold time for POR config signals with respect to negation of HRESET 0 — ns 1, 2 Notes: 1. tSYS_CLK_IN is the clock period of the input clock applied to SYS_CLK_IN. For more details, see the MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Reference Manual . 2. POR configuration signals consist of CFG_RESET_SOURCE[0:3]. Table 10. PLL Lock Times Parameter/Condition Min Max Unit Note PLL lock times — 100 s— Table 11. Reset Signals DC Electrical Characteristics Characteristic Symbol Condition Min Max Unit Note Output high voltage VOH IOH = –6.0 mA 2.4 — V 1 Output low voltage VOL IOL = 6.0 mA — 0.5 V 1 Output low voltage VOL IOL = 3.2 mA — 0.4 V 1 Input high voltage VIH —2.0 OVDD +0.3 V 1 Input low voltage VIL —–0.3 0.8 V — Input current IIN 0 V VIN OVDD — ±5 A— Note: 1. This specification applies when operating from 3.3 V supply. Table 9. RESET Initialization Timing Specifications (continued) |
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