MPC8309CVMADFC datasheet(31/81 Pages) NXP

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MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3

Freescale Semiconductor

HDLC

9.2

TDM/SI AC Timing Specifications

The following table provides the TDM/SI input and output AC timing specifications.

The following figure provides the AC test load for the TDM/SI.

Figure 20. TDM/SI AC Test Load

The following figure represents the AC timing from Table 29. Note that although the specifications

generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge

is the active edge.

Figure 21. TDM/SI AC Timing (External Clock) Diagram

10 HDLC

This section describes the DC and AC electrical specifications for the high level data link control (HDLC),

of the MPC8309.

Table 29. TDM/SI AC Timing Specifications1

Characteristic

Symbol2

Min

Max

Unit

TDM/SI outputs—External clock delay

tSEKHOV

214

TDM/SI outputs—External clock High Impedance

tSEKHOX

210

TDM/SI inputs—External clock input setup time

tSEIVKH

5—

TDM/SI inputs—External clock input hold time

tSEIXKH

2—

Notes:

1. Output specifications are measured from the 50% level of the rising edge of QE_CLK_IN to the 50% level of the signal.

Timings are measured at the pin.

2. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for

inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tSEKHOX symbolizes the TDM/SI

outputs external timing (SE) for the time tTDM/SI memory clock reference (K) goes from the high state (H) until outputs (O)

are invalid (X).

Output

Z0 = 50 

OVDD/2

RL = 50 

TDM/SICLK (Input)

tSEIXKH

tSEIVKH

tSEKHOV

Input Signals:

TDM/SI

(See Note)

Output Signals:

TDM/SI

(See Note)

Note:

The clock edge is selectable on TDM/SI.

tSEKHOX

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