MPC8309CVMADFC datasheet(8/81 Pages) NXP

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MPC8309 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 3

Freescale Semiconductor

Electrical Characteristics

independent of the I/O cell, but are included for a more complete reference. These are not purely I/O buffer

design specifications.

2.1

Overall DC Electrical Characteristics

This section covers the ratings, conditions, and other characteristics.

2.1.1

Absolute Maximum Ratings

The following table provides the absolute maximum ratings.

Table 1. Absolute Maximum Ratings1

Characteristic

Symbol

Max Value

Unit

Notes

Core supply voltage

VDD

–0.3 to 1.26

—

PLL supply voltage

AVDD1

AVDD2

AVDD3

–0.3 to 1.26

—

DDR2 DRAM I/O voltage

GVDD

–0.3 to 1.98

—

PCI, Local bus, DUART, system control and power management,

I2C, SPI, MII, RMII, MII management, eSDHC, FlexCAN, USB and

JTAG I/O voltage

OVDD

–0.3 to 3.6

Input voltage

DDR2 DRAM signals

MVIN

–0.3 to (GVDD +0.3)

DDR2 DRAM reference

MVREF

–0.3 to (GVDD +0.3)

Local bus, DUART, SYS_CLK_IN,

system control and power

management, I2C, SPI, and JTAG

signals

OVIN

–0.3 to (OVDD +0.3)

PCI

OVIN

–0.3 to (OVDD + 0.3)

Storage temperature range

TSTG

–55to150

C—

Notes:

1. Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are stress ratings only, and

functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect device reliability or cause

permanent damage to the device.

2. OVDD here refers to NVDDA, NVDDB, NVDDC, NVDDF, NVDDG, and NVDDH from the ball map.

3. Caution: MVIN must not exceed GVDD by more than 0.3 V. This limit may be exceeded for a maximum of 100 ms during

power-on reset and power-down sequences.

4. Caution: OVIN must not exceed OVDD by more than 0.3 V. This limit may be exceeded for a maximum of 100 ms during

power-on reset and power-down sequences.

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