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AOZ8000CI 데이터시트(PDF) 2 Page - Alpha & Omega Semiconductors

부품명 AOZ8000CI
상세설명  Plastic Encapsulated Device
PDF  4 Pages
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제조업체  AOSMD [Alpha & Omega Semiconductors]
홈페이지  http://www.aosmd.com
Logo AOSMD - Alpha & Omega Semiconductors

AOZ8000CI 데이터시트(HTML) 2 Page - Alpha & Omega Semiconductors

  AOZ8000CI Datasheet HTML 1Page - Alpha & Omega Semiconductors AOZ8000CI Datasheet HTML 2Page - Alpha & Omega Semiconductors AOZ8000CI Datasheet HTML 3Page - Alpha & Omega Semiconductors AOZ8000CI Datasheet HTML 4Page - Alpha & Omega Semiconductors  
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This AOS product reliability report summarizes the qualification result for AOZ8000CI.
Review of the electrical test results confirm that AOZ8000CI pass AOS quality and reliability
requirements for product release. The continuous qualification testing and reliability monitoring
program ensure that all outgoing products will continue to meet AOS quality and reliability standards.
Table of Contents:
I.
Product Description
II.
Package and Die information
III.
Qualification Test Requirements
IV.
Qualification Tests Result
V.
Reliability Evaluation
VI.
Quality Assurance Information
I. Product Description:
The AOZ8000CI is a transient voltage suppressor array designed to protect high speed data lines from ESD and
lightning. The product comes in RoHS compliant, SOT-23 package and is rated over a -40°C to +85°C ambient
temperature range.
.
Absolute Maximum Ratings
Parameter
VP-VN
6V
Peak Pulse Current (Ipp), tp=8/20uS
5A
Storage Temperature (TS)
-65°C to +150°C
ESD Rating per IEC61000-4-2, contact
(1)
±12kV
ESD Rating per IEC61000-4-2, air
(2)
±15kV
ESD Rating per Human Body Model
(2)
±15kV
Junction Temperature (Tj)
-40°C to +125°C
Notes:
(1) IEC-61000-4-2 discharge with CDischarge=150pF, RDischarge=330Ω
(2) Human Body Discharge per MIL-STD-883, Method 3015 CDischarge=100pF, RDischarge=1.5kΩ
II. Package and Die Information:
Product ID
AOZ8000CI
Process
UMC 0.5um 5/18V 2P3M process
Package Type
SOT-23
Die
UE003A3 (size: 716 x 616 um)
L/F material
Copper A194FH
Die attach material
84-3J epoxy
Die bond wire
Au, 1mil
Mold Material
MP8000CH4
Plating Material
Pure Tin



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