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STM32F103XC 데이터시트(PDF) 9 Page - STMicroelectronics |
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STM32F103XC 데이터시트(HTML) 9 Page - STMicroelectronics |
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9 / 118 page ![]() STM32F103xC, STM32F103xD, STM32F103xE Description 9/118 2.1 Device overview Table 2. STM32F103xC, STM32F103xD and STM32F103xE features and peripheral counts Peripherals STM32F103Rx STM32F103Vx STM32F103Zx Flash memory in Kbytes 256 384 512 256 384 512 256 384 512 SRAM in Kbytes 48 64 48 64 48 64 FSMC No Yes Yes Timers General- purpose 4 Advanced- control 2 Basic 2 Comm SPI(I2S)(1) 1. The SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode. 3(2) I2C2 USART 5 USB 1 CAN 1 SDIO 1 GPIOs 51 80 112 12-bit ADC Number of channels 3 16 3 16 3 21 12-bit DAC Number of channels 1 2 CPU frequency 72 MHz Operating voltage 2.0 to 3.6 V Operating temperatures Ambient temperatures: –40 to +85 °C /–40 to +105 °C (see Table 9) Junction temperature: –40 to + 125 °C (see Table 9) Package LQFP64 LQFP100(2), BGA100 2. For the LQFP100 and BGA100 packages, only FSMC Bank1 and Bank2 are available. Bank1 can only support a multiplexed NOR Flash memory using the NE1 Chip Select. Bank2 can only support a 16- or 8- bit NAND Flash memory using the NCE2 Chip Select. The interrupt line cannot be used since Port G is not available in this package. LQFP144, BGA144 |
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