RA2L2 datasheet(32/108 Pages) RENESAS

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Vr(VCC)

VCC

1 / fr(VCC)

Figure 2.2

Ripple waveform

2.2.7

Thermal Characteristics

Maximum value of junction temperature (Tj) must not exceed the value of section 2.2.1. Tj/Ta Definition.

Tj is calculated by either of the following equations.

● Tj = Ta + θja × Total power consumption

● Tj = Tt + Ψjt × Total power consumption

Tj : Junction temperature (°C)

Ta : Ambient temperature (°C)

Tt : Top center case temperature (°C)

θja : Thermal resistance of “Junction”-to-“Ambient” (°C/W)

Ψjt : Thermal resistance of “Junction”-to-“Top center case” (°C/W)

● Total power consumption = Voltage × (Leakage current + Dynamic current)

● Leakage current of IO = Σ (IOL × VOL) / Voltage + Σ (|IOH| × |VCC – VOH|) / Voltage

● Dynamic current of IO = Σ IO (Cin + Cload) × IO switching frequency × Voltage

Cin: Input capacitance

Cload: Output capacitance

Regarding θja and Ψjt, see Table 2.15.

Table 2.15

Thermal resistance

Parameter

Package

Symbol

Value*1

Unit

Test conditions

Thermal resistance

32-pin HWQFN

θja

22.5

°C/W

JESD 51-2 and 51-7

compliant

48-pin HWQFN

19.0

32-pin LQFP

60.9

48-pin LQFP

62.4

64-pin LQFP 0.5mm

pitch

53.6

32-pin HWQFN

Ψjt

0.20

°C/W

JESD 51-2 and 51-7

compliant

48-pin HWQFN

0.18

32-pin LQFP

2.50

48-pin LQFP

2.50

64-pin LQFP 0.5mm

pitch

2.00

Note 1. The values are reference values when the 4-layer board is used. Thermal resistance depends on the number of layers or size of the

board. For details, see the JEDEC standards.

RA2L2 Datasheet

2. Electrical Characteristics

R01DS0445EJ0120 Rev.1.20

Jun 9, 2026

Page 32 of 108

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