| 전자부품 데이터시트 검색엔진 |
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TAS2781RYYR 데이터시트(PDF) 84 Page - Texas Instruments |
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TAS2781RYYR 데이터시트(HTML) 84 Page - Texas Instruments |
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84 / 90 page ![]() www.ti.com EXAMPLE BOARD LAYOUT (R0.05) TYP 0.05 MAX ALL AROUND 0.05 MIN ALL AROUND 19X (0.6) 26X (0.2) (3.3) (3.8) (1.12) 22X (0.4) 8X (0.425) 8X (0.25) 2X (1) (0.925) 2X (1) (0.7) (0.65) 4X (R0.12) (0.95) 2X (0.7) 2X (0.62) 2X (0.78) 2X (0.6) VQFN-HR - 1 mm max height RYY0030A PLASTIC QUAD FLATPACK - NO LEAD 4228222/B 05/2022 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. PKG PKG SEE SOLDER MASK DETAIL EXPOSED METAL SHOWN LAND PATTERN EXAMPLE SCALE: 20X 1 9 10 16 17 23 24 30 METAL EDGE SOLDER MASK OPENING EXPOSED METAL METAL UNDER SOLDER MASK SOLDER MASK OPENING EXPOSED METAL NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS TAS2781 SLOSE86B – JULY 2022 – REVISED JULY 2023 www.ti.com 84 Submit Document Feedback Copyright © 2023 Texas Instruments Incorporated Product Folder Links: TAS2781 |
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