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2N2484UB 데이터시트(PDF) 1 Page - STMicroelectronics |
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1 / 19 page ![]() MIL-PRF-19500/376E 31 August 2000 SUPERSEDING MIL-PRF-19500/376D 21 August 1998 PERFORMANCE SPECIFICATION SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, LOW-POWER TYPES 2N2484, 2N2484UA, 2N2484UB, JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC This specification is approved for use by all Departments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the performance requirements for NPN, silicon, low-power transistors. Four levels of product assurance is provided for each device type as specified in MIL-PRF-19500. Two levels of product assurance are provided for die. 1.2 Physical dimensions. See figure 1 (similar to T0-18), figures 2 and 3 (surface mount case outlines UA and UB), and figures 4 and 5 (die). 1.3 Maximum ratings. PT VCBO VEBO VCEO IC TJ and TSTG RθJA RθJC Types TA = +25 °C mW V dc V dc V dc mA dc °C °C/W °C/W 2N2484 500 (1) 60 6 60 50 -65 to +200 325 146 2N2484UA 650 (2) 60 6 60 50 -65 to +200 210 160 2N2484UB 500 (1) 60 6 60 50 -65 to +200 325 146 (1) Derate linearly at 3.08 mW/ °C above TA = +37.5°C (2) Derate linearly at 4.76 mW/ °C above TA = +63.5°C. 1.4 Primary electrical characteristics. hfe Cobo |hfe|2 VCE(sat) (1) Limits VCE = 5 V dc IC = 1 mA dc f = 1 kHz IE = 0 VCB = 5 V dc 100 kHz ≤ f ≤ 1 MHz IC = 500 µA dc VCE = 5 V dc f = 30 MHz IC = 1.0 mA dc IB = 0.1 mA dc Min Max 250 900 pF 5.0 2.0 7.0 V dc 0.3 (1) Pulsed (see 4.5.1). AMSC N/A FSC 5961 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. The documentation and process conversion measures necessary to comply with this revision shall be completed by 31 November 2000. INCH-POUND Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Defense Supply Center, Columbus, ATTN: DSCC/VAC, Post Office Box 3990, Columbus, OH 43216-5000, by using the Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter. |
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