LTRB RASF

DATASHEET

DATASHEET

27 | Version 1.9 | 2024-11-04

Glossary

1)

Wavelength: Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm.

2)

Forward Voltage: Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of

±0.1 V.

3)

Thermal Resistance: Rth max is based on statistic values (6σ) used for Derating.

4)

Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size ≥ 5 mm² per pad)

5)

Brightness: Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of

±11 %.

6)

Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-

es, the typical data or calculated correlations of technical parameters can only reflect statistical figures.

These do not necessarily correspond to the actual parameters of each single product, which could dif-

fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.

because of technical improvements, these typ. data will be changed without any further notice.

7)

Testing temperature: TA = 25°C (unless otherwise specified)

8)

Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-

ences between single devices within one packing unit.

9)

Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and

dimensions are specified in mm.

10)

Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.