Body temperature should follow the description below:

MKP capacitor

During pre-heating: Tp

≤110 °C

During soldering: Ts

≤120 °C, t

s

≤45 s

MKT capacitor

During pre-heating: Tp

≤125 °C

During soldering: Ts

≤160 °C, t

s

≤45 s

When SMD components are used together with leaded ones, the film capacitors should not pass

into the SMD adhesive curing oven. The leaded components should be assembled after the SMD

curing step.

Leaded film capacitors are not suitable for reflow soldering.

In order to ensure proper conditions for manual or selective soldering, the body temperature of

the capacitor (Ts) must be

≤120 °C.

One recommended condition for manual soldering is that the tip of the soldering iron should

be <360

°C and the soldering contact time should be no longer than 3 seconds.

For uncoated MKT capacitors with lead spacings

≤10 mm (B32560/B32561) the following mea-

sures are recommended:

pre-heating to not more than 110

°C in the preheater phase

rapid cooling after soldering

Please refer to our Film Capacitors Data Book in case more details are needed.

Application note

A Y capacitor to be connected between AC lines and the Frame Ground (FG) has an effect of

emitting common mode current to the FG.Leak current corresponding in frequency and voltage to

the AC power supply flows in the Y capacitor.

As the capacity of a Y capacitor grows, leak current also increases. This can cause electric shock.

Therefore, UL and other safety standards restrict the capacity so that the amount of leak current

does not exceed a certain level. Usually, two Y capacitors are used, as shown in Figure below. As

AC lines are connected with capacitors, they are effective in reducing differential mode noises. In

particular, they are effective for high frequency ranges of 8 to 10 MHz.

Example of EMI suppression, typical application:

B32021 ... B32026

Y2/300VAC

Page 14 of 23

Please read Cautions and warnings and

Important notes at the end of this document.