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TDA7590 데이터시트(PDF) 38 Page - STMicroelectronics

부품명 TDA7590
상세설명  Digital signal processing IC for speech and audio applications
PDF  40 Pages
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제조업체  STMICROELECTRONICS [STMicroelectronics]
홈페이지  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

TDA7590 데이터시트(HTML) 38 Page - STMicroelectronics

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Package information
TDA7590
38/40
9 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 3.
TQFP144 Mechanical data & package dimensions
OUTLINE AND
MECHANICAL DATA
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
A
1.20
0.047
A1
0.05
0.15
0.002
0.006
A2
0.95
1.00
1.05
0.037
0.039
0.041
B
0.17
0.22
0.27
0.007
0.009
0.011
C
0.09
0.20
0.003
0.008
D
21.80
22.00
22.20
0.858
0.866
0.874
D1
19.80
20.00
20.20
0.779
0.787
0.795
D2
2.00
0.079
D3
17.50
0.689
e
0.50
0.020
E
21.80
22.00
22.20
0.858
0.866
0.874
E1
19.80
20.00
20.20
0.779
0.787
0.795
E2
2.00
0.079
E3
17.50
0.689
L
0.45
0.60
0.75
0.018
0.024
0.030
L1
1.00
0.0393
K
3.5˚ (min.), 7˚(max.)
ccc
0.08
0.03
TQFP144
(20x20x1.0mm exposed Pad Down)
7386636
Note 1: Exact shape of each corner is optional.



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