ADP130AUJZ-2.5-R7 datasheet(17/20 Pages) AD

17 / 20 page

ADP130

Rev. 0 | Page 17 of 20

In cases where board temperature is known, use the thermal char-

acterization parameter, ΨJB, to estimate the junction temperature

rise. Maximum junction temperature (TJ) is calculated from the

board temperature (TB) and power dissipation (PD), using the

following formula:

TJ = TB + (PD × ΨJB)

(5)

The typical value of ΨJB is 42.8°C/W for the 5-lead TSOT package.

140

VIN – VOUT (V)

120

100

1mA

10mA

50mA

100mA

150mA

250mA

350mA

(LOAD CURRENT)

MAX TJ (DO NOT OPERATE ABOVE THIS POINT)

0.4

0.8

1.2

1.6

2.0

2.4

2.8

Figure 46. TSOT, TA = 85°C

PRINTED CIRCUIT BOARD LAYOUT

CONSIDERATIONS

Heat dissipation from the package can be improved by increasing

the amount of copper attached to the pins of the ADP130.

However, as shown in Table 6, a point of diminishing returns is

eventually reached, beyond which an increase in the copper size

does not yield significant heat dissipation benefits.

The input capacitor should be placed as close as possible to the

VIN and GND pins. The output capacitor should be placed as

close as possible to the VOUT and GND pins. Using 0402 or 0603

size capacitors and resistors achieves the smallest possible foot-

print solution on boards where the area is limited.

VBIAS

ANALOG DEVICES

ADP130-xx-EVALZ

VIN

VOUT

GND

Figure 47. Example TSOT PCB Layout

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