EMIF02-USB02F2

Package information

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Package information

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Figure 10.

Flip Chip package dimensions

Figure 11.

Footprint recommendations

Figure 12.

Marking

495µm ± 50

495µm ± 50

285 µm

1.62mm ± 50µm

315µm ± 50

700µm ± 50

650µm ± 65

Copper pad Diameter:

250 µm recommended, 300 µm max.

Solder stencil opening:

330 µm recommended

Solder mask opening recommendation:

340 µm min. for 300 µm copper pad diameter

E

x

y

x

w

z

w

Dot, ST logo

xx = marking

z = manufacturing location

yww = datecode

(y = year

ww = week)