Characteristics

EMIF10-COM01C2

4/7

Figure 9.

Aplac model

1.1

PCB grounding recommendations

In order to ensure a good efficiency in terms of ESD protection and filtering behavior, we

recommend to implement microvias (100 µm dia.) between the GND bumps and the GND

layer. GND bumps can be connected together in PCB layer 1, and in addition, if possible,

use through hole vias (200 µm dia.) in both sides of filter to improve contact to GND (layer).

This layout will minimize the distance to the ground and thus parasitic inductances. In

addition, we recommend to have GND plane wherever possible.

Figure 8.

Capacitance versus reverse applied

voltage

10

20

30

40

50

012

345

VR(V)

C(pF)

F=1MHz

Vosc=30mV

Demif10 model

BV = 7

IBV = 1m

CJO = 25p

M = 0.3333

RS = 1

VJ = 0.6

TT = 100n

out

in

200R

MODEL = demif10

MODEL = demif10

sub