Application information

EMIF10-COM01F2

4/7

2

Application information

Figure 9.

Aplac model

2.1

PCB grounding recommendations

In order to ensure a good efficiency in terms of ESD protection and filtering behavior, we

recommend to implement microvias (100 µm dia.) between the GND bumps and the GND

layer. GND bumps can be connected together in PCB layer 1, and in addition, if possible,

use through hole vias (200 µm dia.) in both sides of filter to improve contact to GND (layer).

This layout will minimize the distance to the ground and thus parasitic inductances. In

addition, we recommend to have GND plane wherever possible.

3

Ordering information scheme

Figure 10.

Ordering information scheme

Demif10 model

BV = 7

IBV = 1m

CJO = 25p

M = 0.3333

RS = 1

VJ = 0.6

TT = 100n

out

in

200R

MODEL = demif10

MODEL = demif10

sub

EMIF

yy

-

xxx zz

Fx

EMI Filter

Number of lines

Information

Package

x = resistance value (Ohms)

z = capacitance value / 10(pF)

or

3 letters = application

2 digits = version

F = Flip Chip

x = 2: Lead-free, pitch = 500 µm, bump = 315 µm