EMIF10-COM01F2

Package information

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4

Package information

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the inner box label, in compliance with JEDEC

Standard JESD97. The maximum ratings related to soldering conditions are also marked on

the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at

www.st.com.

Figure 11.

Flip Chip package dimensions

Figure 12.

Footprint recommendations

Figure 13.

Marking

2.39 mm ± 30 µm

315 µm ± 50

500 µm ± 50

650 µm ± 65

Copper pad Diameter:

250 µm recommended, 300 µm max

Solder stencil opening: 330 µm

Solder mask opening recommendation:

340 µm min for 300 µm copper pad diameter

x

y

x

w

z

w

E

Dot, ST logo

xx = marking

yww = datecode

(y = year

ww = week)

z = manufacturing location