TDA7402_07 datasheet(69/71 Pages) STMICROELECTRONICS

69 / 71 page

TDA7402

Package information

69/71

Package information

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a lead-free second level interconnect. The category of

second level interconnect is marked on the package and on the inner box label, in

compliance with JEDEC standard JESD97. The maximum ratings related to soldering

conditions are also marked on the inner box label. ECOPACK is an ST trademark.

ECOPACK specifications are available at: www.st.com.

Figure 39.

LQFP44 (10x10) Mechanical data and package dimensions

OUTLINE AND

MECHANICAL DATA

Note: 1. The size of exposed pad is variable depending of lead-

frame design pad size. End user should verify “D2” and

“E2” dimensions for each device application.

DIM.

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

1.60

0.0630

0.05

0.15

0.0020

0.0059

1.35

1.40

1.45

0.0531 0.0551 0.0571

0.30

0.37

0.45

0.0118 0.0146 0.0177

0.09

0.20

0.0035

0.0079

11.80

12.00

12.20 0.4646 0.4724 0.4803

9.80

10.00

10.20 0.3858 0.3937 0.4016

2.00

0.0787

8.00

0.3150

11.80

12.00

12.20 0.4646 0.4724 0.4803

9.80

10.00

10.20 0.3858 0.3937 0.4016

2.00

0.0787

8.00

0.3150

0.80

0.0315

0.45

0.60

0.75

0.0177

0.0295

1.00

0.0394

3.5˚(min.),7˚(max.)

ccc

0.10

0.0039

LQFP44 (10 x 10 x 1.40mm)

Exposed Pad Down

7278839 C

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