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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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MPC8640DEC 데이터시트(PDF) 117 Page - Freescale Semiconductor, Inc |
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MPC8640DEC 데이터시트(HTML) 117 Page - Freescale Semiconductor, Inc |
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117 / 140 page  MPC8640 and MPC8640D Integrated Host Processor Hardware Specifications, Rev. 1 Freescale Semiconductor 117 Thermal Figure 61. Thermal Performance of Select Thermal Interface Material The board designer can choose between several types of thermal interface. Heat sink adhesive materials should be selected based on high conductivity and mechanical strength to meet equipment shock/vibration requirements. There are several commercially available thermal interfaces and adhesive materials provided by the following vendors: The Bergquist Company 800-347-4572 18930 West 78th St. Chanhassen, MN 55317 Internet: www.bergquistcompany.com Chomerics, Inc. 781-935-4850 77 Dragon Ct. Woburn, MA 01801 Internet: www.chomerics.com Dow-Corning Corporation 800-248-2481 Corporate Center PO Box 994 Midland, MI 48686-0994 Internet: www.dowcorning.com 0 0.5 1 1.5 2 0 1020 30 40 50607080 Silicone Sheet (0.006 in.) Bare Joint Fluoroether Oil Sheet (0.007 in.) Graphite/Oil Sheet (0.005 in.) Synthetic Grease Contact Pressure (psi) |
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