MPC8313CVRGDFB datasheet(64/100 Pages) FREESCALE

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MPC8313CVRGDFB 데이터시트(PDF) 64 Page - Freescale Semiconductor, Inc

부품명	MPC8313CVRGDFB

상세설명	PowerQUICC??II Pro Processor Hardware Specifications

PDF	100 Pages

Scroll/Zoom	100%

제조업체	FREESCALE [Freescale Semiconductor, Inc]

홈페이지	http://www.freescale.com

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64 / 100 page

MPC8313E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 2.1

Freescale Semiconductor

Package and Pin Listings

19.2

Mechanical Dimensions of the MPC8313E TEPBGAII

Figure 56 shows the mechanical dimensions and bottom surface nomenclature of the 516-TEPBGAII

package.

Figure 56. Mechanical Dimension and Bottom Surface Nomenclature of the MPC8313E TEPBGAII

Notes:

1. All dimensions are in millimeters.

2. Dimensions and tolerances per ASME Y14.5M-1994.

3. Maximum solder ball diameter measured parallel to datum A.

4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.

5. Package code 5368 is to account for PGE and the built-in heat spreader.

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