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SC471AEVB 데이터시트(PDF) 7 Page - Semtech Corporation

부품명 SC471AEVB
상세설명  Synchronous Buck Controller with Multi-Level VOUT Transition Support
PDF  27 Pages
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제조업체  SEMTECH [Semtech Corporation]
홈페이지  http://www.semtech.com
Logo SEMTECH - Semtech Corporation

SC471AEVB 데이터시트(HTML) 7 Page - Semtech Corporation

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© 2008 Semtech Corp.
SC471/SC471A
www.semtech.com
POWER MANAGEMENT
Pin Descriptions
Pin
Pin Name
Pin Function
1
LX
Switching (phase) node.
2
BST
Boost capacitor connection for high-side gate drive.
3
VCC
5V power input for the internal circuits and gate drive outputs.
4
DL
Gate drive output for the low-side external MOSFET.
5
GND
Power ground. This is the return point for the DL driver output, and the reference point for the
ILIM and zero cross circuits.
6RTN
Return or analog ground for the FB input and FB resistor divider . Connect to GND directly at the
IC. All feedback components should connect to this ground.
7
D1
Drain of second internal MOSFET which is controlled by G1.
8
D0
Drain of first internal MOSFET which is controlled by G0.
9FB
Feedback sense point. The FB threshold is 0.75V; the resistor divider ratio between VOUT and
FB sets the output voltage. This ratio can be modified using the G0/G1 inputs to switch resistors
in/out at D0/D1.
10
VOUT
Output voltage sense point for determining On-Time.
11
PGOOD
Open-drain power good indicator - a high impedance indicates power is good - an external pull-up
resistor is required.
12
EN
Enable input - connect EN to RTN to disable the SC471/A.
13
ILIM
Current limit sense point — to program the current limit connect a resistor from ILIM to
LX or to a current sense resistor.
14
G0
Control input for the D0 MOSFET. A logic high (low) energizes the D0 MOSFET on the SC471
(SC471A), pulling D0 to ground.
15
G1
Control input for the D1 MOSFET. A logic high (low) energizes the D1 MOSFET on the SC471
(SC471A), pulling D1 to ground.
16
DH
Gate drive output for the high-side external MOSFET.
TPAD
Mounting pad. Not connected internally - connect to system (power) ground plane through prefer-
ably one large via or multiple smaller vias.



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