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TLE2021 데이터시트(PDF) 6 Page - Texas Instruments

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부품명 TLE2021
상세설명  EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
PDF  66 Pages
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제조업체  TI [Texas Instruments]
홈페이지  http://www.ti.com
Logo TI - Texas Instruments

TLE2021 데이터시트(HTML) 6 Page - Texas Instruments

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TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191 – FEBRUARY 1997
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLE2022Y chip information
This chip, when properly assembled, displays characteristics similar to TLE2022. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
× 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE
±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
OUT
IN +
IN –
VCC+
(8)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
IN +
IN –
OUT
(4)
VCC –
80
86
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)



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