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TLE2021 데이터시트(PDF) 7 Page - Texas Instruments

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부품명 TLE2021
상세설명  EXCALIBUR HIGH-SPEED LOW-POWER PRECISION OPERATIONAL AMPLIFIERS
PDF  66 Pages
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제조업체  TI [Texas Instruments]
홈페이지  http://www.ti.com
Logo TI - Texas Instruments

TLE2021 데이터시트(HTML) 7 Page - Texas Instruments

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TLE202x, TLE202xA, TLE202xB, TLE202xY
EXCALIBUR HIGH-SPEED LOW-POWER PRECISION
OPERATIONAL AMPLIFIERS
SLOS191 – FEBRUARY 1997
7
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
TLE2024Y chip information
This chip, when properly assembled, displays characteristics similar to the TLE2024. Thermal compression or
ultrasonic bonding may be used on the doped aluminum-bonding pads. This chip may be mounted with
conductive epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 MILS TYPICAL
BONDING PADS: 4
× 4 MILS MINIMUM
TJmax = 150°C
TOLERANCES ARE
±10%.
ALL DIMENSIONS ARE IN MILS.
PIN (11) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
–
1OUT
1IN +
1IN –
VCC +
(4)
(6)
(3)
(2)
(5)
(1)
–
+
(7)
2IN +
2IN –
2OUT
(11)
VCC – /GND
+
–
3OUT
2IN +
3IN –
(13)
(10)
(9)
(12)
(8)
–
+
(14)
4OUT
4IN +
4IN –
100
140



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