ADP1612ARMZ-R7 datasheet(4/28 Pages) AD

4 / 28 page

ADP1612/ADP1613

Rev. A | Page 4 of 28

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, EN, FB to GND

−0.3 V to +6 V

FREQ to GND

−0.3 V to VIN + 0.3 V

COMP to GND

1.0 V to 1.6 V

SS to GND

−0.3 V to +1.3 V

SW to GND

21 V

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

ESD (Electrostatic Discharge)

Human Body Model

±5 kV

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination.

THERMAL RESISTANCE

Junction-to-ambient thermal resistance (θJA) of the package is

specified for the worst-case conditions, that is, a device soldered

in a circuit board for surface-mount packages. The junction-to-

ambient thermal resistance is highly dependent on the application

and board layout. In applications where high maximum power

dissipation exists, attention to thermal board design is required.

The value of θJA may vary, depending on PCB material, layout,

and environmental conditions.

Table 3.

Package Type

θJA

θJC

Unit

8-Lead MSOP

2-Layer Board1

206.9

44.22

°C/W

4-Layer Board1

162.2

44.22

°C/W

1 Thermal numbers per JEDEC standard JESD 51-7.

BOUNDARY CONDITION

Modeled under natural convection cooling at 25°C ambient

temperature, JESD 51-7, and 1 W power input with 2- and

4-layer boards.

ESD CAUTION

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