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STM8L151C4 데이터시트(PDF) 58 Page - STMicroelectronics

부품명 STM8L151C4
상세설명  8-bit ultralow power MCU, up to 32 KB Flash, 1 KB Data EEPROM RTC, LCD, timers, USART, I2C, SPI, ADC, DAC, comparators
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제조업체  STMICROELECTRONICS [STMicroelectronics]
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STM8L151C4 데이터시트(HTML) 58 Page - STMicroelectronics

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Electrical parameters
STM8L151xx, STM8L152xx
58/101
Doc ID 15962 Rev 2
8.3
Operating conditions
Subject to general operating conditions for VDD and TA.
8.3.1
General operating conditions
Table 15.
General operating conditions
Symbol
Parameter
Conditions
Min
Max
Unit
fSYSCLK
(1)
System clock
frequency
1.65 V
≤VDD < 3.6 V
0
16
MHz
VDD
Standard operating
voltage
1.65(2)
3.6
V
VDDA
Analog operating
voltage
ADC not used
Must be at the same
potential as VDD
1.65(2)
3.6
V
ADC used
1.8
3.6
V
PD
(3)
Power dissipation at
TA= 85 °C for suffix 6
devices
VFQFPN48 (4)
TBD
mW
LQFP48
TBD
WFQFPN32 (5)
TBD
LQFP32
TBD
WFQFPN28 (6)
TBD
Power dissipation at
TA= 125 °C for suffix 3
devices
VFQFPN48(4)
TBD
LQFP48
TBD
WFQFPN32(5)
TBD
LQFP32
TBD
WFQFPN28(6)
TBD
TA
Temperature range
1.65 V
≤VDD < 3.6 V
(6 suffix version)
-40
85
°C
1.65 V
≤VDD < 3.6 V
(3 suffix version)
-40
125
TJ
Junction temperature
range
-40 °C
≤TA < 85 °C
(6 suffix version)
-40
105
°C
-40 °C
≤ TA < 125 °C
(3 suffix version)
-40
130
1.
fSYSCLK = fCPU
2.
1.8 V at power-up, 1.65 V at power-down if BOR is disabled.
3.
To calculate PDmax(TA), use the formula PDmax=(TJmax -TA)/
Θ
JA with TJmax in this table and
Θ
JA in “Thermal characteristics”
table.
4.
VFQFPN48 package is used in the sampling phase. In the production phase, the UFQFPN48 package will be used (with a
thickness equal to 0.6 mm).
5.
WFQFPN32 package is used in the sampling phase. In the production phase, the UFQFPN32 package will be used (with a
thickness equal to 0.6 mm).
6.
WFQFPN28 package is used in the sampling phase. In the production phase, the UFQFPN28 package will be used (with a
thickness equal to 0.6 mm).



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