MCP6141-ESLASHMS datasheet(23/38 Pages) MICROCHIP

23 / 38 page

DS21668D-page 23

MCP6141/2/3/4

6.0

PACKAGING INFORMATION

6.1

Package Marking Information

8-Lead MSOP

Example

XXXXXX

YWWNNN

6143I

918256

5-Lead SOT-23 (MCP6141)

Example:

XXNN

AS25

Device

E-Temp Code

MCP6141

ASNN

Note: Applies to 5-Lead SOT-23

6-Lead SOT-23 (MCP6143)

Example:

XXNN

AW25

Device

E-Temp Code

MCP6143

AWNN

Note: Applies to 6-Lead SOT-23

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note:

In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information.

XXXXXXXX

XXXXXNNN

YYWW

8-Lead PDIP (300 mil)

Example

8-Lead SOIC (150 mil)

Example

XXXXXXXX

XXXXYYWW

NNN

MCP6141

I/P256

0918

MCP6142

I/SN0918

256

MCP6141

E/P

256

0918

MCP6142E

0918

256

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