IMX35 datasheet(21/148 Pages) FREESCALE

21 / 148 page

i.MX35 Applications Processors for Automotive Products, Rev. 6

Freescale Semiconductor

The method for obtaining max current is as follows:

1. Measure worst case power consumption on individual rails using directed test on i.MX35.

2. Correlate worst case power consumption power measurements with worst case power

consumption simulations.

3. Combine common voltage rails based on power supply sequencing requirements

4. Guard band worst case numbers for temperature and process variation. Guard band is based on

process data and correlated with actual data measured on i.MX35.

5. The sum of individual rails is greater than real world power consumption, as a real system does

not typically maximize power consumption on all peripherals simultaneously.

4.6

Thermal Characteristics

The thermal resistance characteristics for the device are given in Table 12. These values were measured

under the following conditions:

•

Two-layer substrate

•

Substrate solder mask thickness: 0.025 mm

•

Substrate metal thicknesses: 0.016 mm

•

Substrate core thickness: 0.200 mm

•

Core via I.D: 0.168 mm, Core via plating 0.016 mm.

•

Full array map design, but nearly all balls under die are power or ground.

•

Die Attach: 0.033 mm non-conductive die attach, k = 0.3 W/m K

•

Mold compound: k = 0.9 W/m K

Table 11. Power Consumption

Power Supply

Voltage (V)

Max Current (mA)

QVCC

1.47

400

MVDD, PVDD

1.65

NVCC_EMI1, NVCC_EMI2, NVCC_EMI3, NVCC_LCDC, NVCC_NFC

1.9

FUSE_VDD (This rail is typically tied to ground; it only needs a voltage if system

fuse burning is needed)

3.6

NVCC_MISC, NVCC_CSI, NVCC_SDIO, NVCC_CRM, NVCC_ATA, NVCC_MLB,

NVCC_JTAG

3.6

OSC24M_VDD, OSC_AUDIO_VDD, PHY1_VDDA, PHY2_VDD,

USBPHY1_UPLLVDD, USBPHY1_VDDA_BIAS

3.6

Table 12. Thermal Resistance Data

Rating

Condition

Symbol

Value

Unit

Junction to ambient1 natural convection

Single layer board (1s)

ReJA

ºC/W

Junction to ambient1 natural convection

Four layer board (2s2p)

ReJA

ºC/W

Junction to ambient1 (at 200 ft/min)

Single layer board (1s)

ReJMA

ºC/W

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