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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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TLE8262E 데이터시트(PDF) 9 Page - Infineon Technologies AG |
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TLE8262E 데이터시트(HTML) 9 Page - Infineon Technologies AG |
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9 / 93 page  Data Sheet 9 Rev. 1.0, 2009-03-31 TLE8262E Pin Configuration 26 RxDLIN LIN Transceiver Data Output; according to the ISO 9141 and LIN specification 2.1 as well as SAE J2602-2; push-pull output; LOW in dominant state. 27 n.c. Not connected 28 n.c. Not connected 29 n.c. Not connected 30 n.c. Not connected 31 GND Ground 32 n.c. Not connected 33 n.c not connected 34 WK Monitoring / Wake-Up Input; bi-level sensitive input used to monitor signals coming from, for example, an external switch panel; also used as wake-up input; 35 Limp Home Fail-Safe Function Output; Open drain. Active LOW. 36 Test SBC SW Development Mode entry; Connect to GND for activation; Integrated pull- up resistor. Connect to V S or leave open for normal operation. EDP - Exposed Die Pad; For cooling purposes only, do not use it as an electrical ground.1) 1) The exposed die pad at the bottom of the package allows better dissipation of heat from the SBC via the PCB. The exposed die pad is not connected to any active part of the IC and can be left floating or it can be connected to GND for the best EMC performance. Pin Symbol Function |
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