TLE8262E datasheet(91/93 Pages) INFINEON

91 / 93 page

Data Sheet

Rev. 1.0, 2009-03-31

TLE8262E

Package Outline

Figure 44

PG-DSO-36-38 (Leadframe A6901-003);)

Note: For the SBC product family the package PG-DSO-36-38 with the leadframe A6901-C003 is used.

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly products and to be compliant with

government regulations, the Universal System Basis Chip is available as a green product. Green products are

RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-

020).

PG-DSO-36-24, -38, -41, -42-PO V08

Exposed Diepad

Index Marking

1) Does not include plastic or metal protrusion of 0.15 max. per side

2) Does not include dambar protrusion of 0.05 max. per side

3) Distance from leads bottom (= seating plane) to exposed diepad

4) Exclunding the mold flash allowance of 0.3mm MAX per side

Index Marking

Ejector Mark

Polish Finish

Bottom View

0.65

17 x 0.65 = 11.05

±0.08

0.33

A-B

0.17 M

36x

0.1

36x

SEATING PLANE

-0.2

7.6

0.35 x 45˚

0.7 ±0.2

10.3 ±0.3

12.8 -0.2

PG-DSO-36-38

PG-DSO-36-24, -41, -42

Package

A6901-C007

A6901-C003

A6901-C001

Leadframe

5.2

4.6

PG-DSO-36-24

A6901-C008 6.0

5.4

5.1

Exposed Diepad Dimensions

Ejector Mark

Cavity ID

For information about packages and types of packing, refer to the

Infineon Internet Page “Products”: http://www.infineon.com/products.

Dimensions in mm

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