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DM562AP 데이터시트(PDF) 47 Page - Davicom Semiconductor, Inc.

부품명 DM562AP
상세설명  V.90 Integrated Data/ Fax/Voice/Speakerphone Modem Device Single Chip with Memory Built in
PDF  48 Pages
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제조업체  DAVICOM [Davicom Semiconductor, Inc.]
홈페이지  http://www.davicom.com.tw
Logo DAVICOM - Davicom Semiconductor, Inc.

DM562AP 데이터시트(HTML) 47 Page - Davicom Semiconductor, Inc.

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DM562AP
V.90 Integrated Data/ Fax/Voice/Speakerphone
Modem Device Single Chip with Memory Built in
LQFP 48L (F.P. 2mm) Outline Dimensions
unit: inches/mm
y
D1
D
Symbol
Dimensions in inches
Dimensions in mm
Min.
Nom.
Max.
Min.
Nom.
Max.
A
-
-
0.063
-
-
1.60
A1
0.002
-
0.006
0.05
-
0.15
A2
0.053
0.055
0.057
1.35
1.40
1.45
b
0.007
0.009
0.011
0.17
0.22
0.27
b1
0.007
0.008
0.009
0.17
0.20
0.23
C
0.004
-
0.008
0.09
-
0.20
C1
0.004
-
0.006
0.09
-
0.16
D
0.354BSC
9.00BSC
D1
0.276BSC
7.00BSC
E
0.354BSC
9.00BSC
E1
0.276BSC
7.00BSC
e
0.020BSC
0.50BSC
L
0.018
0.024
0.030
0.45
0.60
0.75
L1
0.039REF
1.00REF
y
0.003MAX
0.08MAX
Θ
0-12°
0-12°
Notes:
1. To be determined at seating plane.
2. Dimensions D1 and E 1do not include mold
protrusion. D1 and E1 are maximum plastic body
size dimensions including mold mismatch.
3. Dimensions b does not include dam bar protrusion.
Total in excess of the b dimension at maximum
material condition. Dam bar cannot be located on
the lower radius of the foot.
4. Exact shape of each corner is optional.
5. These dimensions apply to the flat section of the
lead between 0.10mm and 0.25mm from the lead
tip.
6. A1 is defined as the distance from the seating
plane to the lowest point of the package body.
7. Controlling dimension: millimeter.
8. Reference documents: JEDEC MS-026, BBC.
Final
47
Version: DM562AP-DS-F03
Nov. 09, 2007



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