PCF8533USLASH2SLASHF2 datasheet(34/45 Pages) NXP

34 / 45 page

PCF8533_4

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Product data sheet

Rev. 04 — 5 March 2010

34 of 45

NXP Semiconductors

PCF8533

Universal LCD driver for low multiplex rates

14. Bare die description

14.1 Gold bump hardness

[1]

Pressure of diamond head: 10 g to 50 g.

14.2 Alignment marks

14.3 Bump locations

Table 20.

Gold bump hardness

Type number

Min

Max

Unit[1]

PCF8533U/2/F2

120

PCF8533U/2DA/2

The positions of the alignment marks are shown in Figure 2 and Figure 25.

Fig 24. Alignment marks of PCF8533

Table 21.

Alignment mark locations

Symbol

X (

μm)

Y (

μm)

2300.5

55.0

−2320.2

107.0

−2208.3

−165.4

REF

mgl756

Table 22.

Bump locations

All x/y coordinates represent the position of the centre of each bump with respect to the center

(x/y = 0) of the chip; see Figure 25.

Symbol

Bump

X (

μm)

Y (

μm)

Description

SDAACK

−1079.20 −594.40

[1] I2C-bus acknowledge output

SDA

−839.20

−594.40

[1] I2C-bus serial data input

SDA

−759.20

−594.40

[1]

SCL

−599.20

−594.40

I2C-bus serial clock input

SCL

−519.20

−594.40

CLK

−414.80

−594.40

clock input/output

VDD

−284.80

−594.40

supply voltage

SYNC

84.20

−594.40

cascade synchronization input/output

OSC

119.20

−594.40

oscillator select

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