SG1842/SG1843 Series

PRODUCT DA T ABOOK 1996/1997

Copyright © 2000

Rev. 1.6a 10/04

2

ABSOLUTE MAXIMUM RATINGS

(Notes 1 & 2)

Supply Voltage (I

Supply Voltage (Low Impedance Source) ........................................................ 30V

Output Current (Peak) ....................................................................................... ±1A

Output Current (Continuous) ....................................................................... 350mA

Output Energy (Capacitive Load) ....................................................................... 5µJ

Analog Inputs (Pins 2, 3) ................................................................. -0.3V to +6.3V

Error Amp Output Sink Current ..................................................................... 10mA

Power Dissipation at T

Operating Junction Temperature

Hermetic (J, Y, F, L Packages) ................................................................... 150°C

Plastic (N, M, D, DM Packages) ................................................................ 150°C

Storage Temperature Range .......................................................... -65°C to +150°C

Lead Temperature (Soldering, 10 Seconds) .................................................. 300°C

PACKAGE PIN OUTS

V

REF

V

CC

OUTPUT

GND

COMP

V

FB

I

SENSE

R

1

8

27

36

45

M & Y PACKAGE

(Top View)

DM PACKAGE

(Top View)

V

REF

V

CC

OUTPUT

GND

COMP

V

FB

I

SENSE

R

1

8

27

36

45

V

REF

N.C.

V

CC

V

C

OUTPUT

GND

PWR GND

COMP

N.C.

V

FB

N.C.

I

SENSE

N.C.

R

1

14

213

312

411

510

69

78

D PACKAGE

(Top View)

M PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

95°C/W

N PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

65°C/W

DM PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

165°C/W

D PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

120°C/W

Y PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

130°C/W

J PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

80°C/W

F PACKAGE:

THERMAL RESISTANCE-JUNCTION TO CASE,

θθθθθ

JC

80°C/W

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

145°C/W

L PACKAGE:

THERMAL RESISTANCE-JUNCTION TO CASE,

θθθθθ

JC

35°C/W

THERMAL RESISTANCE-JUNCTION TO AMBIENT,

θθθθθ

JA

120°C/W

Junction Temperature Calculation: T

The

θ

system. All of the above assume no ambient airflow.

THERMAL DATA

Note 1. Exceeding these ratings could cause damage to the device.

Note 2. All voltages are with respect to Pin 5. All currents are positive into the specified

terminal.

1

14

213

312

411

510

69

78

J & N PACKAGE

(Top View)

COMP

N.C.

V

FB

N.C.

I

SENSE

N.C.

R

V

REF

N.C.

V

CC

V

C

OUTPUT

GROUND

POWER GND

F PACKAGE

(Top View)

10.V

REF

9. V

CC

8. V

C

7. OUTPUT

6. GND

1. COMP

2. V

FB

3. I

SENSE

4. R

5. POWER GND

1

10

29

38

47

56

L PACKAGE

(Top View)

32

4

5

6

7

8

911

10

1. N.C.

2. COMP

3. N.C.

4. N.C.

5. V

FB

6. N.C.

7. I

SENSE

8. N.C.

9. N.C.

10. R

120 19

18

17

16

15

14

12 13

11. N.C.

12. GROUND

13. N.C.

14. N.C.

15. OUTPUT

16. N.C.

17. V

CC

18. N.C.

19. N.C.

20. V

REF

Pb-free / RoHS Peak Package Solder Reflow Temp. (40 second max. exposure)........ 260°C (+0, -5)

Pb-free / RoHS 100% Matte Tin Lead Finish

Pb-free / RoHS 100% Matte Tin Lead Finish

N Package: Pb-free / RoHS 100% Matte Tin Lead Finish

M Package: Pb-free / RoHS 100% Matte Tin Lead Finish