ADS5400

SLAS611B – OCT 2009 – REVISED MARCH 2010

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Table 1. PACKAGE/ORDERING INFORMATION

SPECIFIED

PACKAGE

PACKAGE

ORDERING

TRANSPORT

PRODUCT

PACKAGE-LEAD

TEMPERATURE

MARKING

NUMBER

MEDIA, QUANTITY

RANGE

ADS5400IPZP

Tray, 90

HTQFP-100

ADS5400

PZP

–40°C to 85°C

ADS5400I

PowerPAD

ADS5400IPZPR

Tape and reel, 1000

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

AVDD5 to GND

6

V

Supply voltage

AVDD3 to GND

5

V

DVDD3 to GND

5

V

voltage difference between pin and ground

0.5 to 4.5

V

short duration

–0.3 to (AVDD5 + 0.3)

V

voltage difference between

pins, common mode at

continuous AC signal

1.25 to 3.75

V

AVDD5/2

continuous DC signal

1.75 to 3.25

V

voltage difference between pin and ground

0.5 to 4.5

V

voltage difference between

continuous AC signal

1.1 to 3.9

V

pins, common mode at

continuous DC signal

2 to 3

V

AVDD5/2

voltage difference between pin and ground

–0.3 to (AVDD5 + 0.3)

V

continuous AC signal

1.1 to 3.9

V

voltage difference between

pins

continuous DC signal

2 to 3

V

–0.3 to (DVDD3 + 0.3)

–0.3 to (AVDD3 + 0.3)

voltage difference between pin and ground

V

ENA1BUS, ENPWD, ENEXTREF

–0.3 to (AVDD5 + 0.3)

Operating temperature range

–40 to 85

°C

150

°C

Storage temperature range

–65 to 150

°C

ESD, human-body model (HBM)

2

kV

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime is available upon

request.

(2)

Valid when supplies are within recommended operating range.

THERMAL CHARACTERISTICS

(1)

PARAMETER

TEST CONDITIONS

TYP

UNIT

Soldered thermal pad, no airflow

28.4

(2)

Soldered thermal pad, 150-LFM airflow

16.6

°C/W

Soldered thermal pad, 250-LFM airflow

13.5

(3)

Bottom of package (thermal pad)

0.16

°C/W

(1)

Using 25 thermal pad vias (5 × 5 array). See PowerPAD Package in the Application Information section.

(2)

(3)

2

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