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PCF8564AU/10AA/1 데이터시트(PDF) 37 Page - NXP Semiconductors

부품명 PCF8564AU/10AA/1
상세설명  Real time clock and calendar
PDF  44 Pages
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제조업체  NXP [NXP Semiconductors]
홈페이지  http://www.nxp.com
Logo NXP - NXP Semiconductors

PCF8564AU/10AA/1 데이터시트(HTML) 37 Page - NXP Semiconductors

Back Button PCF8564AU/10AA/1 Datasheet HTML 33Page - NXP Semiconductors PCF8564AU/10AA/1 Datasheet HTML 34Page - NXP Semiconductors PCF8564AU/10AA/1 Datasheet HTML 35Page - NXP Semiconductors PCF8564AU/10AA/1 Datasheet HTML 36Page - NXP Semiconductors PCF8564AU/10AA/1 Datasheet HTML 37Page - NXP Semiconductors PCF8564AU/10AA/1 Datasheet HTML 38Page - NXP Semiconductors PCF8564AU/10AA/1 Datasheet HTML 39Page - NXP Semiconductors PCF8564AU/10AA/1 Datasheet HTML 40Page - NXP Semiconductors PCF8564AU/10AA/1 Datasheet HTML 41Page - NXP Semiconductors Next Button
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PCF8564A_1
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 1 — 8 October 2009
37 of 44
NXP Semiconductors
PCF8564A
Real time clock and calendar
18.2 Tape and reel information
[1]
Die is placed in pocket bump side down.
19. Soldering of WLCSP packages
19.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
Fig 32. Tape and reel details for PCF8564ACX9/B/1
Table 34.
Tape and reel dimensions [1]
Dimension
Description
Value
W
tape width
8 mm
A0
pocket length
1.5 mm
B0
pocket width
2.2 mm
K0
pocket depth
0.25 mm
P1
pocket pitch
4 mm
Transparent top view. The orientation of the IC in a pocket is indicated by the position of pin 1, with
respect to the sprocket holes.
Fig 33. Pin 1 indication for PCF8564ACX9/B/1
4 mm
K0
A0
P1
B0
direction of feed
013aaa202
W
013aaa191
pin 1



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