전자부품 데이터시트 검색엔진
  Korean  ▼
ALLDATASHEET.CO.KR

X  

INT202 데이터시트(PDF) 4 Page - Power Integrations, Inc.

부품명 INT202
상세설명  Low-side Drive and High-side Control for Simultaneous Conduction
PDF  12 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
제조업체  POWERINT [Power Integrations, Inc.]
홈페이지  http://www.powerint.com
Logo POWERINT - Power Integrations, Inc.

INT202 데이터시트(HTML) 4 Page - Power Integrations, Inc.

  INT202 Datasheet HTML 1Page - Power Integrations, Inc. INT202 Datasheet HTML 2Page - Power Integrations, Inc. INT202 Datasheet HTML 3Page - Power Integrations, Inc. INT202 Datasheet HTML 4Page - Power Integrations, Inc. INT202 Datasheet HTML 5Page - Power Integrations, Inc. INT202 Datasheet HTML 6Page - Power Integrations, Inc. INT202 Datasheet HTML 7Page - Power Integrations, Inc. INT202 Datasheet HTML 8Page - Power Integrations, Inc. INT202 Datasheet HTML 9Page - Power Integrations, Inc. Next Button
Zoom Inzoom in Zoom Outzoom out
 4 / 12 page
background image
INT202
F
2/96
4
4
General Circuit Operation
The three-phase switched reluctance
motor drive circuit shown in Figure 4
illustrates a typical application for the
INT202/201. The LS IN signal directly
controls MOSFET Q1. The
HSINsignal
causes the INT202 to command the
INT201 to turn MOSFET Q2 on or off as
required.
Local bypassing for the low-side driver
is provided by C1. Bootstrap bias for the
high-side driver is provided by D1 and
C2. Slew rate and effects of parasitic
oscillations in the load waveforms are
controlled by resistors R1 and R2.
The inputs are designed to be compatible
with 5 V CMOS logic levels and should
not be connected to V
DD. Normal CMOS
power supply sequencing should be
observed. The order of signal application
should be V
DD, logic signals, and then
HV+. V
DD should be supplied from a
low impedance voltage source.
The length of time that the high-side can
remain on is limited by the size of the
bootstrap capacitor. Applications with
extremely long high-side on times
require special techniques discussed in
AN-10.
Maximum frequency of operation is
limited by power dissipation due to high-
voltage switching, gate charge, and bias
power. Figure 5 indicates the maximum
switching frequency as a function of
input voltage and gate charge. For higher
ambient temperatures, the switching
frequency should be derated linearly.
Figure 5. Switching Frequency versus Gate Charge for a) PDIP and b) SOIC.
100
0
0
100
200
Gate Charge (nC)
200
300
400
VIN = 200 V
VIN = 300 V
VIN = 400 V
PDIP
100
0
0
100
200
Gate Charge (nC)
200
300
400
VIN = 200 V
VIN = 300 V
VIN = 400 V
SOIC



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12


데이터시트 다운로드

Go To PDF Page


링크 URL



ALLDATASHEET 가 귀하에 도움이 되셨나요?  [ DONATE ] 

Alldatasheet는?   |   광고문의   |   운영자에게 연락하기   |   개인정보취급방침   |   링크 투 데이터시트    |   링크교환   |   제조사별 검색
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com