M24C16-RBN3TPSLASHS datasheet(35/39 Pages) STMICROELECTRONICS

35 / 39 page

M24C16, M24C08, M24C04, M24C02, M24C01

Revision history

Doc ID 5067 Rev 16

35/39

Revision history

Table 30.

Document revision history

Date

Version

Changes

10-Dec-1999

2.4

TSSOP8 Turned-Die package removed (p 2 and order information)

Lead temperature added for TSSOP8 in table 2

18-Apr-2000

2.5

Labelling change to Fig-2D, correction of values for ‘E’ and main caption for

Tab-13

05-May-2000

2.6

Extra labelling to Fig-2D

23-Nov-2000

3.0

SBGA package information removed to an annex document

-R range changed to being the -S range, and the new -R range added

19-Feb-2001

3.1

SBGA package information put back in this document

Lead Soldering Temperature in the Absolute Maximum Ratings table

amended

Write Cycle Polling Flow Chart using ACK illustration updated

References to PSDIP changed to PDIP and Package Mechanical data

updated

Wording brought in to line with standard glossary

20-Apr-2001

3.2

Revision of DC and AC characteristics for the -S series

08-Oct-2001

3.3

Ball numbers added to the SBGA connections and package mechanical

illustrations

09-Nov-2001

3.4

Specification of Test Condition for Leakage Currents in the DC

Characteristics table improved

30-Jul-2002

3.5

Document reformatted using new template. SBGA5 package removed

TSSOP8 (3x3mm² body size) package (MSOP8) added. -L voltage range

added

04-Feb-2003

3.6

Document title spelt out more fully. “W”-marked devices with tw=5ms

added.

05-May-2003

3.7

-R voltage range upgraded to 400kHz working, and no longer preliminary

data.

5V voltage range at temperature range 3 (-xx3) no longer preliminary data.

-S voltage range removed. -Wxx3 voltage+temp ranged added as

preliminary data.

07-Oct-2003

4.0

Table of contents, and Pb-free options added. Minor wording changes in

Summary Description, Power-On Reset, Memory Addressing, Read

Operations. VIL(min) improved to

-0.45V. tW(max) value for -R voltage range corrected.

17-Mar-2004

5.0

MLP package added. Absolute Maximum Ratings for VIO(min) and

VCC(min) changed. Soldering temperature information clarified for RoHS

compliant devices. Device grade information clarified. Process

identification letter “G” information added. 2.2-5.5V range is removed, and

4.5-5.5V range is now Not for New Design

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