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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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PC912XDP512F0MPVR 데이터시트(PDF) 1243 Page - Freescale Semiconductor, Inc |
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PC912XDP512F0MPVR 데이터시트(HTML) 1243 Page - Freescale Semiconductor, Inc |
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1243 / 1348 page  Appendix A Electrical Characteristics MC9S12XDP512 Data Sheet, Rev. 2.21 Freescale Semiconductor 1245 Table A-5. Thermal Package Characteristics1 1 The values for thermal resistance are achieved by package simulations Num C Rating Symbol Min Typ Max Unit LQFP144 1 T Thermal resistance LQFP144, single sided PCB2 θJA —— 41 °C/W 2 T Thermal resistance LQFP144, double sided PCB with 2 internal planes3 θJA —— 32 °C/W 3 Junction to Board LQFP 144 θJB —— 22 °C/W 4 Junction to Case LQFP 1444 θJC — — 7/4 °C/W 5 Junction to Package Top LQFP1445 ΨJT —— 3 °C/W LQFP112 6 T Thermal resistance LQFP112, single sided PCB2 2 Junction to ambient thermal resistance, θJA was simulated to be equivalent to the JEDEC specification JESD51-2 in a horizontal configuration in natural convection. θJA —— 433/494 3 Maskset L15Y / M84E in LQFP112 or QFP80 4 Maskset M42E in LQFP112 or QFP80 °C/W 7 T Thermal resistance LQFP112, double sided PCB with 2 internal planes5 5 Junction to ambient thermal resistance, θJA was simulated to be equivalent to the JEDEC specification JESD51-7 in a horizontal configuration in natural convection. θJA —— 323/394 °C/W 8 Junction to Board LQFP112 θJB —— 223/274 °C/W 9 Junction to Case LQFP1124 θJC —— 73/114 °C/W 10 Junction to Package Top LQFP1125 ΨJT — — 3/2 °C/W QFP80 11 T Thermal resistance QFP 80, single sided PCB2 θJA —— 453/494 °C/W 12 T Thermal resistance QFP 80, double sided PCB with 2 internal planes3 θJA —— 333/364 °C/W 13 T Junction to Board QFP 80 θJB —— 193/204 °C/W 14 T Junction to Case QFP 806 6 Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique with the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the package is being used with a heat sink. θJC —— 113/144 °C/W 15 T Junction to Package Top QFP 807 7 Thermal characterization parameter ΨJT is the “resistance” from junction to reference point thermocouple on top center of the case as defined in JESD51-2. ΨJT is a useful value to use to estimate junction temperature in a steady state customer enviroment. ΨJT —— 3 °C/W |
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