D+

3

1

2

D–

GND

10

N.C.

D1+

1

9

N.C.

D1

–

2

8

GND

GND

3

7

N.C.

D2+

4

6

N.C.

D2

–

5

TPD2EUSB30, TPD4EUSB30

www.ti.com

SLVSAC2 – AUGUST 2010

2, 4-CHANNEL ESD SOLUTION FOR SUPER-SPEED (6 GBPS) USB 3.0 INTERFACE

Check for Samples: TPD2EUSB30, TPD4EUSB30

1

FEATURES

TPD2EUSB30DRTR PACKAGE

•

Single and Dual-Pair Differential Lines to

(TOP VIEW)

Protect the Differential Data and Clock Lines of

the USB3.0, eSATA, or LVD Interface

•

Flow-Through Pin Mapping for the High-Speed

Lines Ensures Zero Additional Skew Due to

Board Layout While Placing ESD-Protection

Chip Near the Connector

TPD4EUSB30DQAR PACKAGE

•

Supports Data Rates in Excess of 6 Gbps

(TOP VIEW)

•

ESD Protection Meets or Exceeds

IEC61000-4-2 (Level 4)

•

Low Capacitance 0.05pF (IO to IO)

•

5-A Peak Pulse Current (per 8/20 ms Pulse)

•

Industrial Temperature Range: –40°C to 85°C

•

Space-Saving DRT, DQA Packages

APPLICATIONS

•

Notebooks

•

Set-Top Boxes

•

DVD Players

•

Media Players

•

Portable Computers

DESCRIPTION/ORDERING INFORMATION

The TPD2EUSB30 and TPD4EUSB30 provide 2 and 4 channel ESD clamp circuits with flow-through pin

mapping for ease of board layout. These devices have been designed to protect sensitive components which are

connected to ultra high-speed data and transmission lines. The TPDxEUSB30 offer protection from stress

caused by ESD (electrostatic discharge). These devices also offer 5 A (8/20 ms) peak pulse current ratings per

IEC 61000-4-5 (lightning) specification.

The monolithic silicon technology allows matching between the differential signal pairs. The differential 0.05-pF

capacitance ensures that the signal distortion due to added ESD clamp remains minimal at high-speed

differential data transmission.

The TPD2EUSB30 and TPD4EUSB30 conform to IEC61000-4-2 (Level 4) ESD protection. The TPD2EUSB30 is

offered in space saving DRT (1 mm × 1 mm) package. The TPD4EUSB30 is offered in space saving DQA (1 mm

× 2.5 mm) package.

The TPD2EUSB30 and TPD4EUSB30 are characterized for operation over ambient air temperature range of

–40°C to 85°C.

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2010, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.