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Datasheet

Boxed Processor Specifications

7.1

Mechanical Specifications

7.1.1

Boxed Processor Cooling Solution Dimensions

This section documents the mechanical specifications of the boxed Pentium 4 processor on 90 nm

process in the 775-land package. The boxed processor will be shipped with an unattached fan

heatsink. Figure 7-1 shows a mechanical representation of the boxed Pentium 4 processor in the

775-land package.

Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The

physical space requirements and dimensions for the boxed processor with assembled fan heatsink

are shown in Figure 7-2 (side view), and Figure 7-3 (top view). The airspace requirements for the

boxed processor fan heatsink must also be incorporated into new baseboard and system designs.

Airspace requirements are shown in Figure 7-7 and Figure 7-8. Note that some figures have

centerlines shown (marked with alphabetic designations) to clarify relative dimensioning.

NOTES:

1. Diagram does not show the attached hardware for the clip design and is provided only as a mechanical

representation.

Figure 7-2. Space Requirements for the Boxed Processor (Side View)

Figure 7-3. Space Requirements for the Boxed Processor (Top View)

3.74

[95.0]

3.2

[81.3]

0.39

[10.0]

0.98

[25.0]

3.74

[95.0]

3.74

[95.0]

521 데이터시트(PDF) 90 Page - Intel Corporation