MPC8535E datasheet(109/126 Pages) FREESCALE

109 / 126 page

Thermal

MPC8535E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 3

Freescale Semiconductor

109

2.23.6

Frequency Options

2.23.6.1

SYSCLK to Platform Frequency Options

Table 78 shows the expected frequency values for the platform frequency when using a CCB clock to SYSCLK ratio in

comparison to the memory bus clock speed.

2.24

Thermal

This section describes the thermal specifications of the MPC8535E.

2.24.1

Thermal Characteristics

Table 79 provides the package thermal characteristics.

Table 78. Frequency Options of SYSCLK with Respect to Memory Bus Speeds

CCB to

SYSCLK Ratio

SYSCLK (MHz)

33.33

41.66

66.66

100

111

133.33

Platform /CCB Frequency (MHz)

333

400

333

400

444

333

415

500

400

500

333

417

400

500

Table 79. Package Thermal Characteristics

Characteristic

JEDEC Board

Symbol

Value

Unit

Notes

Junction-to-ambient Natural Convection

Single layer board (1s)

RθJA

°C/W

1, 2

Junction-to-ambient Natural Convection

Four layer board (2s2p)

RθJA

°C/W

1, 2

Junction-to-ambient (@200 ft/min)

Single layer board (1s)

RθJA

°C/W

1, 2

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