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AS8650

Datasheet - A b s o l u t e M a x i m u m R a t i n g s

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only. Functional operation of the

device at these or any other conditions beyond those indicated in Electrical Characteristics on page 7 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

1

Parameter

Min

Max

Units

Notes

Electrical Parameters

-0.3

40

V

Voltage at pin V5V_LDO1, V5V_LDO2,

V5V_LDO3, VLDO1, VLDO2, VLDO3, FB,

VLDO1FB, VLDO2FB, VLDO3FB

-0.3

7

V

Voltage at pin CANH, CANL, SPLIT

-40

+40

V

Voltage at pin LX, WAKE

-0.3

V

Voltage at pin RESET, INTN, RxD, TxD, CS,

SCLK, SDO, SDA/SDI, I2C_EN

-0.3

4.5

V

1

V/µs

Input power supply ramp rate

Electrostatic Discharge

Electrostatic discharge voltage

AEC-Q100-002 human body model standard

(ESD)

±2

kV

All pins except VSUP, GND, CANH, CANL,

WAKE, SPLIT

±4

VSUP, GND, WAKE, SPLIT

±8

CANH, CANL

Latch-Up Immunity

-100

+100

mA

AEC-Q100-004

Continuous Power Dissipation

1.2

W

Temperature Ranges and Storage Conditions

ºC

-50

+125

ºC

30

ºC/W

SEMI G42-88

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020 “Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State

Surface Mount Devices”.

The lead finish for Pb-free leaded packages is

matte tin (100% Sn).

Moisture Sensitivity Level

3

Represents a maximum floor life time of 168h