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전자부품 데이터시트 검색엔진 |
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전자부품 데이터시트 검색엔진 |
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TMS570LS3137 데이터시트(PDF) 155 Page - Texas Instruments |
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TMS570LS3137 데이터시트(HTML) 155 Page - Texas Instruments |
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155 / 159 page  TMS570LS3137 www.ti.com SPNS162. – SEPTEMBER 2011 6 Mechanical Data 6.1 Thermal Data Table 6-1 shows the thermal resistance characteristics for the QFP - PGE mechanical package. Table 6-2 shows the thermal resistance characteristics for the BGA - ZWT mechanical package. Table 6-1. Thermal Resistance Characteristics (PGE Package) PARAMETER °C / W R ΘJA 45 R ΘJC 5 Table 6-2. Thermal Resistance Characteristics (ZWT Package) PARAMETER °C / W R ΘJA 18.8 R ΘJC 7.1 6.2 Packaging Information The following packaging information reflects the most current released data available for the designated device(s). This data is subject to change without notice and without revision of this document. Copyright © 2011, Texas Instruments Incorporated Mechanical Data 155 Submit Documentation Feedback focus.ti.com: TMS570LS3137 |
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