EMIF06-MSD02N16

Recommendation on PCB assembly

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5

Recommendation on PCB assembly

5.1

Stencil opening design

1.

General recommendation on stencil opening design

a)

Stencil opening dimensions: L (Length), W (Width), T (Thickness).

Figure 16.

Stencil opening dimensions

b)

General design rule

Stencil thickness (T) = 75 ~ 125 µm

2.

Reference design

a)

Stencil opening thickness: 100 µm

b)

Stencil opening for central exposed pad: Opening to footprint ratio is 50%.

c)

Stencil opening for leads: Opening to footprint ratio is 90%.

Figure 17.

Recommended stencil window position

L

T

W

Aspect Ratio

W

T

-----

1.5

≥

=

Aspect Area

LW

×

2T L

W

+

()

----------------------------

0.66

≥

=

0.30

0.45

0.20

0.40

1.6

0.70

2.30

3.00

200 µm

190 µm

15 µm

15 µm

5µm

5µm

2800 µm

300 µm

2100 µm

350 µm

350 µm

50 µm

50 µm

Footprint

Stencil window

Footprint