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Document Number: 89030

4

Revision: 10-May-11

This document is subject to change without notice.

SS8P2CL, SS8P3CL

Vishay General Semiconductor

New Product

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

Conform to JEDEC TO-277A

TO-277A (SMPC)

0.016 (0.40)

0.006 (0.15)

0.047 (1.20)

0.039 (1.00)

0.146 (3.70)

0.134 (3.40)

0.087 (2.20)

0.075 (1.90)

0.189 (4.80)

0.173 (4.40)

0.049 (1.24)

0.037 (0.94)

0.053 (1.35)

0.041 (1.05)

0.030 (0.75) NOM.

0.084 (2.13) NOM.

0.155 (3.94)

NOM.

Mounting Pad Layout

0.268

(6.80)

0.186 (4.72)

MIN.

0.050 (1.27)

MIN.

0.041

(1.04)

0.055 (1.40)

MIN.

0.189 (4.80)

MIN.

0.187 (4.75)

0.175 (4.45)

0.262 (6.65)

0.250 (6.35)

0.242 (6.15)

0.238 (6.05)

0.171 (4.35)

0.167 (4.25)

K

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