| 전자부품 데이터시트 검색엔진 |
|
STTS2002 데이터시트(PDF) 46 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
STTS2002 데이터시트(HTML) 46 Page - STMicroelectronics |
|
46 / 52 page ![]() Package mechanical data STTS2002 46/52 Doc ID 15389 Rev 5 The landing pattern recommendations per the JEDEC proposal for the TDFN package (DN) are shown in Figure 18. The preferred implementation with wide corner pads enhances device centering during assembly, but a narrower option is defined for modules with tight routing requirements. Figure 18. Landing pattern - TDFN8 package (DN) e/2 e/2 e2 K K E2/2 E2/2 E2 D2/2 D2 D2/2 L L e b b b2 b4 K2 K2 K2 E3 E3 e4 ai14000 |
|
링크 URL |
| ALLDATASHEET 가 귀하에 도움이 되셨나요? [ DONATE ] |
Alldatasheet는? | 광고문의 | 운영자에게 연락하기 | 개인정보취급방침 | 링크 투 데이터시트 | 링크교환 | 제조사별 검색 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |