ADL5240ACPZ-R7 datasheet(20/24 Pages) AD

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ADL5240

Rev. 0 | Page 20 of 24

VDD

DSAOUT

VDD

DSAIN

ADL5240

SERIAL PARALLEL INTERFACE

68pF

1.2nF

470nH

VDD

100pF

VDD

0.1µF

RFOUT

0.1µF

RFIN

1µF

VCC

100pF

910

32 31

Figure 37. AMP-DSA Loop Configuration

THERMAL CONSIDERATIONS

The ADL5240 is packaged in a thermally efficient, 5 mm × 5 mm,

32-lead LFCSP. The thermal resistance from junction to air (θJA)

is 36.8oC/W. The thermal resistance for the product was extracted

assuming a standard 4-layer JEDEC board with 25 conductive,

epoxy filled thermal vias. The thermal resistance from junction

to case (θJC) is 6.9oC/W, where case is the exposed pad of the

lead frame package.

The ADL5240 consumes approximately 93 mA with a 5 V supply

voltage. Even though the part dissipates less than 0.5 W, for the

best thermal performance, it is recommended to add as many

thermal vias as possible under the exposed pad of the LFCSP.

The thermal resistance values given in this section assume a

minimum of 25 thermal vias arranged in a 5 × 5 array with a

diameter of 13 mils and a pitch of 25 mils. Figure 38 shows a

close-up of the thermal via distribution under the exposed pad.

Figure 38. Exposed Pad with Thermal Via Distribution

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