AD9577BCPZ datasheet(16/44 Pages) AD

16 / 44 page

AD9577

Data Sheet

Rev. 0 | Page 16 of 44

ABSOLUTE MAXIMUM RATINGS

THERMAL CHARACTERISTICS

Table 13.

Parameter

Thermal impedance measurements were taken on a 4-layer

board in still air in accordance with EIA/JESD51-7.

Rating

VS to GND

−0.3 V to +3.6 V

REFCLK to GND

−0.3 V to VS + 0.3 V

Table 14. Thermal Resistance

Package Type

θJA

LDO to GND

−0.3V to VS + 0.3 V

Unit

XT1, XT2 to GND

−0.3 V to VS + 0.3 V

40-Lead LFCSP

27.5

°C/W

−0.3 V to VS + 0.3 V

SSCG, MAX_BW, MARGIN, SCL, SDA,

REFSEL to GND

REFOUT, OUTxP, OUTxN to GND

−0.3 V to VS + 0.3 V

ESD CAUTION

Junction Temperature1

150°C

Storage Temperature

−65°C to+150°C

Lead Temperature (10 sec)

300°C

1 See the Thermal Characteristics section for θJA.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

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